硅片超精密磨床的發(fā)展現(xiàn)狀
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% d. \0 ^0 S+ `0 `1 r' ?董志剛,, 田業(yè)冰,, 康仁科, 郭東明,, 金洙吉
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4 f" v6 l6 x. z/ ~& K1 e0 J. H, o(大連理工大學(xué)精密與特種加工教育部重點(diǎn)實(shí)驗(yàn)室 遼寧 大連 116024)
% z6 u# B% r; v9 K- l4 V% T 摘 要: 硅片超精密磨床是半導(dǎo)體集成電路(IC)制造中的關(guān)鍵裝備,,主要應(yīng)用于IC制程中的硅片制備加工和IC后道制程中圖形硅片的背面減薄。國(guó)外硅片超精密磨床制造技術(shù)發(fā)展很快,,具有高精度化,、集成化、自動(dòng)化等特點(diǎn),。介紹了超精密磨床在大尺寸(≥φ300 mm)硅片超精密加工中的應(yīng)用狀況,,詳細(xì)評(píng)述了國(guó)外先進(jìn)硅片超精密磨床的特點(diǎn),并指出了大尺寸硅片超精密加工技術(shù)的發(fā)展趨勢(shì),。
4 p0 I1 d, o5 ~9 k+ ^% }8 B 關(guān)鍵詞:超精密磨床,;超精密磨削;金剛石砂輪,;硅片,;集成電路(IC)
- ?* k: J' A/ N1 X- cDevelopment Status of Ultra-precision Grinding Machine�,。妫铮� Silicon Wafer
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DONG Zhi-gang, TIAN Ye-bing,, KANG Ren-ke,, GUO Dong-min, JIN Zhu-ji3 z% z y0 k" G5 L/ G% k, O
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(Key Laboratory for Dalian University of Technology Precision & Non-traditional
4 U/ J8 } R% A4 O3 pMachining of Ministry of Education,, Dalian 116024,, China) Abstract: Ultra-precision grinding machine is one of the key equipments in integrated circuit manufacturing, which is mainly used in both manufacture of primary wafer and backside thinning of patterned wafer. The advanced ultra-precision grinding machines have been developed and have features of high precision,, integratization and automatization etc. In this paper,, the present status of the ultra-precision grinding machines applied in large scale wafer (≥φ300mm) are introduced, their features are analyzed in detail,, and the development trends of ultra-precision machining technology for large scale wafer are predicted.
6 F# C6 P/ @2 Y( U* e9 o4 S% Q" T KeyWords: Ultra-precision grinding machine,; Ultra-precision grinding; Diamond grinding wheel,; Silicon wafers,; IC
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其余見(jiàn)附件
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